Amkor Technology
Yu-Chun Chen is a seasoned professional with extensive experience in the semiconductor packaging and advanced technology sectors. Currently serving as the Director of the Chiplets/FCBGA Business Unit at Amkor Technology, Inc., since September 2015, Yu-Chun has a proven track record in customer account management, program management, research and development, quality assurance, and business strategy. Prior to this role, Yu-Chun worked at Intel Corporation from June 2011 to July 2015, where responsibilities spanned technology transfer integration and process development as a Senior Packaging R&D Engineer and Senior Process Engineer. An academic background includes a PhD and Master’s degree in Electrical and Computer Engineering from Auburn University, along with research roles at Georgia Institute of Technology and the Carnegie Institution for Science, focusing on advanced materials and fabrication techniques.
Amkor Technology
3 followers
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.