Naomi Yoshida

Naomi Yoshida is a Senior Director at Applied Materials with over two decades of experience in various roles within the company, specializing in integrated materials solutions, memory technology, and silicon products. Key achievements include leading significant process integration programs for advanced memory technologies such as 3D NAND and DRAM, developing high-k metal gate integration solutions for sub-7 nm nodes, and conducting extensive reliability testing for advanced interconnects. Prior to the current role, Naomi served as a member of technical staff in areas including chip testing and process algorithm development. Additionally, Naomi has contributed to the IEDM Conference as the Advanced Logic Technology Subcommittee Chair and has a background in process engineering with a focus on electroplating and chemical vapor deposition from early career experience in Japan. Naomi holds a Master's degree in Physics from International Christian University.