Axus Technology
Hoang Nguyen is a seasoned engineer with extensive experience in the semiconductor industry, currently serving as a Senior Process Engineer at Axus Technology since May 2018. Prior roles include Senior Applications Engineer at FUJIFILM Planar Solutions, LLC from June 2016 to May 2018, and Process Yield Engineer at Compound Photonics from May 2014 to May 2016, where Hoang contributed to wafer level fill operations and yielded enhancements for LCOS micro display production. Additionally, Hoang held various CMP (Chemical Mechanical Planarization) engineering positions at IM Flash, Western Digital, STMicroelectronics, and IPEC Corp. Hoang holds a Bachelor of Science in Electrical Engineering with a focus on Microelectronics and Solid State from Arizona State University.
Axus Technology
Axus Technology delivers advanced process development expertise, equipment, and service support for: -- CMP & Polishing -- Wafer Thinning and Grinding -- Edge Grinding and Profline -- Substrate Cleaning Applications -- Wafer Bonding Applications. Axus' customers range from leading-edge production semiconductor manufacturers through small development facilities. We deliver surface processing solutions to a broad range of technologies, including semiconductor, MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, as well as for virtually any application where material needs to be made flatter, smoother, or thinner. Axus Technology supports a global customer base with a high-quality customer support experience known for delivering high quality, and often highly customized, processes and equipment. The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.