Sudip Chakraborty

Senior Technical Lead (hands On) - Clearance And Collateral Technology at BNY Mellon

Sudip Chakraborty is a seasoned technology professional with extensive experience in the financial services industry. Currently serving as a Senior Technical Lead in Clearance and Collateral Technology at BNY Mellon since January 2020, Sudip specializes in the design and development of collateral management workflows and is a Google Certified Professional Cloud Architect. Prior to this role, Sudip held various technical leadership positions at Citi, where responsibilities included overseeing operations and technology initiatives in the Cash Securities domain and migrating applications to a microservices architecture. Additional experience includes roles at Credit Suisse, Bank of America, Barclays Capital, Lehman Brothers, AIG, and TCS across technical lead and software architect roles. Sudip holds a Bachelor of Engineering degree in Electronics and Telecommunication from Gauhati University.

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New York, United States

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BNY Mellon

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BNY Mellon is a global investments company dedicated to helping its clients manage and service their financial assets throughout the investment lifecycle. Whether providing financial services for institutions, corporations or individual investors, BNY Mellon delivers informed investment and wealth management and investment services in 35 countries.


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