Himanshu Pratap Singh Janghela

Himanshu Pratap Singh Janghela is currently employed as a Software Support Engineer at Esko since November 2023. Previously, Himanshu served as a Techno Commercial Executive at A B Polypacks Pvt Ltd from October 2022 to November 2023 and worked as a Packaging Intern at Radcom Packaging Pvt. Ltd. in early 2022, focusing on sustainable packaging solutions across various sectors including FMCG and pharmaceuticals. Himanshu holds a Post Graduate Diploma in Packaging from the Indian Institute of Packaging (2020-2022) and a B.Tech in Printing & Packaging Engineering from Guru Jambheshwar University (2016-2020). Additionally, Himanshu obtained a Diploma in Printing Technology from Yashwantrao Chavan Maharashtra Open University (2014-2016) and a Diploma in Tabla from Indira Kala Sangeet Vishwavidyalaya (2008-2014).