PiBond
Markus Laukkanen has extensive work experience in various roles within the field of process development and engineering. Markus started their career at Okmetic as a production planner in 2000 and worked there until 2006. Markus then moved to Silecs Oy and held the position of Manager of Process Engineering from 2006 to 2014. Markus then joined Silecs International Pte.Ltd as the Manager of Process Engineering from 2012 to 2014. In 2014, they joined Inkron as an Application Manager and worked there until 2015. Markus then joined WineConnection Finland in 2019 as the Founder. Currently, Markus is serving as the Senior Manager of Process Development at PiBond since 2015.
Markus Laukkanen's educational history includes attending the Metropolia University of Applied Sciences, where they pursued studies in Chemical Process Engineering. The duration of their time at the university and the completion of a degree are not specified in the provided information.
PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.