Pliops
Naseem Jamal has a diverse work experience spanning multiple companies and roles. Naseem is currently employed at Pliops as the Director of Hardware and Product Engineering, a position they have held since October 2022. Prior to this role, they worked at Apple as a Physical Design Engineer from June 2018 to November 2019. Before that, they were employed at Qualcomm as a Staff Manager-Platforms from November 2016 to May 2018, where they were responsible for team leadership and management as well as technical tasks related to Qualcomm's Dragonboard platforms. Naseem also has experience at SolarEdge as a Sr. Failure Analysis and Design Review Engineer from July 2014 to November 2016, where they received recognition for their outstanding work. Naseem started their career at EZchip and Mellanox Technologies, where they held various roles related to board design and engineering. Overall, Naseem Jamal has a strong background in hardware and product engineering, with experience in team leadership, design review, and technical problem-solving.
Naseem Jamal has a strong educational background, with qualifications in both business administration and engineering. In 2017, they completed their Master of Business Administration (MBA) in Business Administration and Management, General, at the Technion - Israel Institute of Technology. Prior to this, from 2003 to 2007, they pursued a Bachelor of Science (BSc) in Electrical and Electronics Engineering at the same institution. Additionally, from 2000 to 2002, they attended Jatt and earned their degree in Electrical and Electronics Engineering with honors. Naseem also has ongoing education at the Technion - Israel Institute of Technology, where they are currently studying towards their second MBA degree in Business Administration.
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Pliops
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Today’s explosive data growth and rapidly expanding application workloads threaten to overwhelm datacenters, preventing organizations from harnessing AI/ML, 5G, big data analytics, IoT, and other modern applications they need to achieve their business goals. Accelerating these data-hungry, storage-intensive applications requires more application speed, storage capacity, data efficiency, and scalability than most organizations can afford, no matter how many CPUs and SSDs they add, or how much they expand their datacenter footprint. Just as GPUs overcome processing inefficiencies to accelerate artificial intelligence and advanced analytics performance, the breakthrough Pliops Extreme Data Processor (XDP) overcomes storage inefficiencies to massively accelerate performance and dramatically reduce overall infrastructure costs for databases, analytics, and machine learning. Delivered on an easy-to-deploy, low-profile PCIe card, the Pliops XDP radically simplifies the way data is processed and flash storage is managed. The result is an exponential increase in performance, reliability, capacity, and efficiency— multiplying the effectiveness of organizations’ infrastructure investments. Pliops multiplies the effectiveness of organizations’ infrastructure investments by exponentially increasing datacenter performance, reliability, capacity, and efficiency. Delivered on an easy-to-deploy, low-profile PCIe card, the breakthrough Pliops Extreme Data Processor (XDP) radically simplifies the way data is processed and flash is managed. Pliops overcomes storage inefficiencies to massively accelerate performance and dramatically reduce overall infrastructure costs for data-hungry, storage-intensive applications such as AI/ML, 5G, big data analytics, and IoT. Founded in 2017 and named as one of the 10 hottest semiconductor startups by CRN in 2020, Pliops has raised $115M to date from leading investors. Learn more at www.pliops.com.