Vijay V.

Vijay V. has extensive experience in engineering, particularly in the field of integrated circuit packaging, accumulated over two decades in the industry. Since November 2002, Vijay V. has held multiple positions at Skyworks Solutions, Inc., progressing from Senior IC Packaging Engineer to Technical Director. Prior to this role, Vijay V. worked as a Packaging Engineer at Conexant Systems Inc. from July 2001 to October 2002. Academically, Vijay V. earned a Master of Science in Mechanical Engineering from Texas A&M University and a Bachelor of Technology in Mechanical Engineering from the Indian Institute of Technology, Madras.