STATS ChipPAC
Jason Balistoy is a seasoned Technical Project Manager at Apple since September 2020 and has held various managerial and engineering roles at STATS ChipPAC since March 2008, where responsibilities include overseeing Leaded FOL process engineering activities and ensuring seamless transitions for products into high-volume manufacturing. Previous experience includes a brief tenure as a Staff Engineer at Unisem and roles in process engineering at STATS ChipPAC and UTAC. Jason completed education at Bohol Island State University and Bohol State College.
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STATS ChipPAC
STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.