Summit Interconnect
Gerry Partida has extensive experience in the technology and engineering sectors, currently serving as Co-Chair of IPC-6012 since January 2022. Prior to this role, Gerry has held various leadership positions at Summit Interconnect since September 2012, including Vice President of Technology, Director of Technology, and Director of Engineering. Gerry's career also includes experience as an Engineering Manager at MEI (Marcel Electronics International) from September 1997 to September 2012 and as an Application Engineer at Orbotech from October 1986 to August 1993.
Summit Interconnect
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn manufacturing and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.