Summit Interconnect
Tom S Doslak Jr. is currently the Vice President of Business Development at Summit Interconnect, the second largest printed circuit board manufacturer in the United States. Previously, Tom S held various roles in sales and marketing at Streamline Circuits Corp., TTM, DDI, and Sigma Circuits. Tom graduated from California State University, Chico in 1991 with a degree in communications.
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Summit Interconnect
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn manufacturing and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.