Teledyne offers unmatched MEMS capability, from design to prototyping on 150mm wafers to volume 200mm production.  Teledyne DALSA and Teledyne Micralyne combine to collaborate with customers offering decades of experience across a vast process portfolio.  Our deep expertise in materials and processes, combined with state-of-the-art facilities and collaborative R&D resources drive continuous improvement, learning, and innovation.  Teledyne MEMS delivers a scalable suite of MEMS and microfabrication capabilities that allow customers to ramp up to meet their business development goals. 



Semiconductor

Teledyne MEMS

Teledyne MEMS' headquarters in Edmonton, Canada

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People (19)

Steve Bonham

Dawn McBride

Collin Twanow

Glen Fitzpatrick

Dean Spicer

Alex Stickel

Pooja Bhadula

Jared Crawford

Ben Z.

John Ferguson

Joseph V. Caputo

Andy van Popta

Arjun Dhiman

William Cully

Dan Djukich

Murali Pai

Brenda Petersen

Erin Robinson

Jayson Loewen

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