Tessolve
Balaji Prabhakar is an experienced semiconductor professional currently serving as Vice President of Physical Design at Tessolve since June 2022. Prior to this role, Balaji held the position of Chief Executive Officer at Pico2Femto Semiconductor from May 2020 to May 2022 and served as Engineering Manager at Intel Corporation from May 2017 to May 2020. Balaji's extensive experience includes senior design roles at ClariPhy Communications, Texas Instruments, AppliedMicro, Cypress Semiconductor, and Sasken Communication Technologies, focusing on physical design, implementation, and clock tree design across various technology nodes. Balaji holds a Master's degree in VLSI Design from Anna University Chennai and a Bachelor of Engineering in Electrical Engineering from Shanmugha Arts, Science, Technology and Research Academy.
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Tessolve
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3000+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across multiple market segments, 7 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.