TSMC
Yu Feng Lin is a Senior Engineer at 台積電 since November 2021. Prior to this role, Yu Feng Lin served as a Field Application Engineer at Smiths Interconnect from September 2016 to November 2021 and worked as a Field Services Engineer at 應用材料公司 from November 2013 to September 2016. Yu Feng Lin holds a Master's degree in Mechanical Engineering from National Chiao Tung University, obtained between 2014 and 2016, and a Bachelor's degree in Mechanical Engineering from National Taiwan University, completed from 2009 to 2013.
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Taiwan Semiconductor Manufacturing Company, also known as Taiwan Semiconductor, operates as a semiconductor foundry.