Amkor Technology
Eric Chambers, CFA, MBA, currently serves as Vice President of Finance & Treasury and Vice President of Treasurer at Amkor Technology, Inc. since February 2018. Prior to this role, Eric held the position of Director of Global Treasury at Artesyn Embedded Technologies from July 2014 to February 2018, and worked as Associate Director/Manager of Treasury at Apollo Education Group from May 2010 to June 2014. Earlier experience includes serving as a Senior Treasury Analyst at US Airways from March 2008 to May 2010 and as a Financial Analyst at Hendricks & Partners from May 2007 to March 2008. Eric holds an MBA in Finance from the W. P. Carey School of Business at Arizona State University and a Bachelor of Science in Finance from the University of Arizona.
Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.