Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.

Semiconductor

Amkor Technology

Amkor Technology's headquarters in Tempe, AZ, United States

Giel Rutten

John A Jenson

Ian Lao

Tony Tsao

Prasad Dhond

Troy Philbert

Ken Stratton

Pj Rivera

Nelson Lin

Mike Forman

Yoann Robillard

Dave Schulze

Kelvin Cheng

Justin B. Williams

Allison Grigg

Megan Faust

Mark Rogers

Steve Shin

Susan Kim

Daniel Liao

Robert Morse

Gil Tily

David Watson

Winston Churchill

Doug Alexander

MaryFrances McCourt

James Kim

Roger Carolin

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People (8)

Gerard John

Yu-Chun Chen

Doug Scott

Dale Robinson

Michael Lloyd

Kevin Crowl

Eric Chambers

Suresh Jayaraman

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